Generally all electronic devices generate heat energy during functioning because of thermal resistance, which is one of the significant Electronic News.
The total amount of heat energy dissipates is equal to the total input energy to the device.
The generation of heat energy from electronic devices is due to the thermal resistance of semiconductor device.
When current passes through any circuit, the resistor/capacitor blocks the excess incoming current through the thermal process and dissipates the energy in the form of heat.
When the thermal resistance of a material is high, the heat dissipation is higher and vice versa.
The material is not quality, when it generates high amount of heat during processing or functioning.
Heat dissipation varies for different materials depending on mass, attachments, molding thickness, junction resistance values, etc.
Some capacitors may store heat instead of energy, which results in dissipation of more heat.
Generation of heat normally happens because of high thermal resistivity of any electrical resistors.
The dynamic heat dissipation capability of any electronic circuit (thermal RC circuit) is defined by the product of R (Resistor) and C (Capacitor).
Some Thermal Interface Materials are used in thermal transfer surfaces (has high thermal conductivity in Z direction) to increase thermal transfer efficiency and decrease over-heat in the circuit.